PTH (Plating Through Hole)Jetchem’s alkaline activator system provides a very
dense and uniform Palladium layer, with an excellent
initial overage power to the electroless copper.
◆ Less Pink-ring phenomenon with Multilayers
◆ High Stability of Activator
◆ Without Tin residue problems
◆ Without HCI present in the activator, and no Corrosion in plant area
High reliability and performance
◆ Superior bath stability
◆ Low foaming activator
◆ Minimal palladium absorption by copper surface
◆ Compatible with current level PTH equipment Horizontal Process
◆ Lower Operation Costs
Widely application with different equipment system
◆ Activator PC-65-Vertical application
◆ Activator VCF-Vertical continues application
◆ Activator PC-65H-Horizontal application
◆ Activator LC-Horizontal application
◆ Activator 4.0 – Horizontal application
Low Speed/薄銅◆ Electroless Copper 168 1.2–1.7 um/h
◆ Electroless Copper RF 1.2–1.7 um/h
◆ Electroless Copper ECT-H 1.8–2.5 um/h
Medium Speed/中速銅◆ Electroless Copper MC 2.6–3.0um/h
◆ Electroless Copper MB 2.5–3.0um/h
◆ Electroless Copper VCF 2.6–3.0um/h
◆ Electroless Copper HT 2.5–3.0um/h
◆ Electroless Copper HTR 2.4–3.0um/h
◆ Electroless Copper 910 4.0–6.0 um/h